Vacuum Sputtering

Process

  • Single or multi-layer
  • Multi-cathode
  • Multi-zone
  • Rotatable or planar magnetron
  • In-line optical monitoring (VLT, R, Color)
  • Plasma emission control
  • In-line resistance monitoring
  • Plasma pre-treat

Typical Deposition Materials

  • Metals & alloys
    • Gold, Silver, Platinum, Palladium, Titanium, Silver, Aluminum, Nickel, Copper, Inconel, Stainless Steel, Chrome, Copper, Zirconium

  • Oxides, nitrides, and carbides
    • Indium Tin Oxide (ITO), Silicone Oxide, Titanium Oxide, Zinc Oxide, Aluminum Oxide, Titanium Nitride, Chrome Nitride, Titanium Carbide, And Silicone Carbide

San Diego, CA, USA

  • Met-5
    • Capabilities
      • Coating width: 74” (1.9m)
      • Single chamber (dual drum) with 6 rotatable cathodes
    • Key advantages
      • Wide width high speed metallic sputtering (up to 800 FPM)

  • NV-2
    • Capabilities
      • Coating width: 54” (1.4m)
      • 2 chambers with 6 planar cathodes
      • AC or DC sputtering
    • Key advantages
      • high speed production of multi-layer and complex optical coatings
      • Versatile: Dual chambers and multi-cathode

Zulte, Belgium

  • RC-3
    • Capabilities
      • Coating width: 62"
      • Single chamber with 4 rotatable targets and 3 planar targets
    • Key advantages
      • Wide width high speed metallic sputtering

  • RC-4
    • Capabilities
      • Coating width: 54"
      • Single chamber, three rotatable targets
    • Key advantages
      • Wide width high speed metallic sputtering